

“One-stop-shop for fast turn-around time for simple or complex, prototype & production boards with quality and competitive pricing”
PCB Fabrication
High Density Interconnects for PCB size reduction or placing more components on a given real estate.Micro-vias (Blind, Buried, Resin-filled, Copper-filled, Staggered, & Stacked) (laser drilling or sequential layer build).
We provide services that span the entire design process: Ideation, Proof-of-Concept Design, Optimization, Prototyping, EVT/DVT, DFM/A, and Scale to Manufacturing.
Our streamlined design process delivers your solutions in the shortest possible time. We can marshal your design from Proof-of-Concept all the way to Manufacturing.
We provide robust, rapid, full-service electrical, mechanical, software and firmware solutions to our Clients for digital data acquisition, management, security and storage.
We bring the lean start-up approach to innovation in companies of all sizes!
PCB Fabrication
Prototype & Production
- High Density Interconnects for PCB size reduction or placing more components on a given real estate.
- Micro-vias (Blind, Buried, Resin-filled, Copper-filled, Staggered, & Stacked) (laser drilling or sequential layer build).
- Our system includes Design Rule Checking (DRC), and follow-up processes for Design for Manufacturing (DFM), and Design for Assembly (DFA).
- Lean manufacturing techniques for competitive prices.
- Comply with international standards such as RoHS. The quality grade of our PCB fabrications conforms to IPC 2, while our assembled PCBs conform to IPC 3 grade.
- Certified UL, ISO13485, ISO9001, TS16949, and QS9002 production facilities
- Team of professional experts in our global team.
- Expedited service plan allows us to deliver your PCBs from 2 days to a maximum of 2 weeks.



Our System Includes
Design Rule Checking (DRC), and follow-up processes for Design for Manufacturing (DFM), and Design for Assembly (DFA)
PCB & Flex PCB Capabilities
- PCB Fabrication capabilities are listed below.
- Please contact us for any of your special requirements that you do not find here.
Parameter | Range | Units |
---|---|---|
Active PCB size | Maximum 22 x 17 | inch |
Clearance between copper and solder resist | Minimum 0.004 | inch |
Copper Weights | ½, 1, 2, 3 | oz |
Drill Size | Smallest recommended: 0.008 | inch |
Gap between SMD Pads | Minimum 0.005 | inch |
Legend (Ink) | Colors: white (standard), yellow | - |
Materials used | FR-4 (High Tg), PTFE, Polyimide | - |
Mechanical Features | Scoring, routing, counter-boring, counter-sinking, edge-chamfering, and more. | - |
Multi-Layered | 1-12 or more | Nos. |
PCB Thickness | 0.008 to 0.126 | inch |
Plated hole aspect ratio (depth: diameter) | 6:1 for 0.063 inch thick PCB | - |
Solder Resist (Liquid Photo-Imageable) | Colors: silver grey, white, black, blue, red, green | - |
Surface Finish | HASL (Leaded and Lead-Free) Immersion Silver (0.2 microns) Immersion Gold (0.1 micron) over Electroless Nickel (5 microns) | - |
Track Width / Spacing | ½ oz copper: minimum 0.004/0.004 1 oz copper: minimum 0.006/0.006 2 oz copper: minimum 0.008/0.008 3 oz copper: minimum 0.012/0.012 | inch |
Electrical Test Specifications
Parameter | Range | Units |
---|---|---|
Test Area | Maximum 24 x 20 | inch |
Number of Probes | 2 on Front, 2 on Rear | Nos. |
Board Size | Minimum 3 x 3 | inch |
Board thickness for clamping | Maximum 0.24 | inch |
Repeatable Accuracy | ±0.4 | mil |
Resolution | 0.24 | mil |
Pad Pitch | Minimum 7 | mil |
Test Voltage for Continuity Test | 0 - 10 | VDC |
Test Voltage for Isolation Test | 250 | VAC |
Test Current for Resistance Test | 2.5 µA – 150 mA | - |
Typical Delivery Times for PCBs including Flex-Rigid PCBs
Type | Sample(Days) | Production(Weeks) |
---|---|---|
Single-Sided | 2-10 | 2-4 |
Double-Sided | 2-10 | 2-4 |
Multi-Layered | 2-10 | 2-4 |
Rigid-Flex | 2-10 | 2-4 |
Technical Specification for Flexible PCBs
Parameter | Dimension | Units |
---|---|---|
Thickness PCB Single Sided including CVL (minimum) | 3.15 | mil |
Thickness PCB Double Sided including CVL (minimum) | 8.27 | mil |
Track Width and Spacing (minimum) | 0.003 | inch |
Hole Diameter (minimum) | 0.012 | inch |
Tolerance Hole Diameter (Before Plating) | ±0.002 | inch |
Tolerance Hole Diameter (After Plating) | ±0.004 | inch |
Tolerance Outline (Hard Punch Tool) | ±0.002 | inch |
Tolerance Pitch | ±0.002 | inch |
Tolerance Track Width (% of width) | ±20 | % |
Economic Length of Flexible PCB (maximum) | 20 | inch |

Steller Engineering
Steller engineering product company. Did end to end product design, development, test, and compliance for Propel.Our product is acquired by DentSply & Serona and we highly rate Xekera for all product designs.
Richard Johnson
Managing Partner-MidAtlantic Fund
Expert in PCB Manufacturing
I just wanted to let you know that yesterday the PCBs got here, and you guys did a great job! We love Xekera’s engineering, designing, and fast production cycle abilities.I’ve had a great experience and will be using you again.I recommended you to my colleagues.
Marcos Lam
Hardware Engineer - Fluidigm
Excellent Service
Xekera is the great engineering company when it comes to Hardware and Software.I know life of the engineering team is not easy, but we really admire their quality work with great turnaround time.
Nofil Fawwad
Director of Engineering - Intel
Great to work with Xekera Systems
It was great to work with Xekera System when he had to develop a product in a crunch and did not have the bandwidth in-house.Salman and his Xekera team delivered quality design service with extremely fast turn-around.