XEKERA SYSTEMS CLIENT NOTE ON COVID-19. READ MORE...!

  1-408-915-9849  rfq@xekera.com

HDI Capabilities

Mechanical Drilling Laser Drilling
Low Cost in Equipment ++ +
Low Cost in Production + ++
Required Facilities Drilling Machine Laser Machine
Consumable Drill Bits, Backup Board None
Aspect Ratio 9 1
Via Size Capacity 200 um~ 50~100um
Speed 140 H/min 20,000 H/min
Throughput - +
Prepreg RCC
Low Cost ++ -
Strength ++ +
Hole wall roughness - +
Laminating control + -
Dielectric thickness 45um ~ 30um ~ 80um
Smear residue on target pad - ++
Dielectric constant 3.9 ~ 4.7 3.2 ~ 3.8
Shelf time ++ +
Working PNL size ++ +
MATERIAL TYPE
  • FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
  • FR 4 High Tg ( Tg. 160 – 180 ℃ )
  • RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  • Ink ( VIL )

OUR FABRICATION & ASSEMBLY SERVICES

PCB
FABRICATION
EXPRESS LASER
STENCIL SERVICE
PCB
ASSEMBLY
LASER CUT SOLDER
PASTE
STENCIL
PCB CONFORMAL
COATING
MATERIAL LIST

HDI CAPABILITIES

FLEX/RIGID FLEX